TSMC is currently one of the most renowned companies in the tech industry. Its factories produce chips for major names in segments such as mobile processors and AI hardware. The firm’s next major technological leap will be the 2nm (N2) production process. At a recent event, TSMC confirmed that its 2nm process is coming soon, with mass production scheduled for this year.
Despite Samsung’s recent Samsung Foundry disaster, TSMC has earned its position in the semiconductor production market through its own merits. The company has consistently delivered cutting-edge, high-performance technologies year after year. That’s why it’s currently the preferred choice of Qualcomm, Apple, NVIDIA, AMD, and others.
During the latest North American Technology Symposium 2025, TSMC confirmed that its N2 wafers are ready to begin mass-producing 2nm chips starting in the second half of 2025. The company will implement gate-all-around (GAA) nanosheet transistors for the first time. It’s noteworthy that Samsung attempted to base its 3nm process on GAA technology, with disastrous results. However, this doesn’t seem to be the fault of the technology itself but rather the current state of Samsung Foundry. Insiders have previously confirmed that TSMC already boasts a high yield rate for 2nm chips.
TSMC’s 2nm process will also be key for the AI industry
TSMC was already a giant in mobile processor production. However, the era of artificial intelligence has given it a leading role. NVIDIA’s AI chips use components produced by TSMC. The company will also produce AMD’s EPYC ‘Venice’ CPUs for data centers. Of course, we can’t forget Qualcomm and Apple, whose next-generation smartphone chips (Snapdragon 8 Elite 2 and Apple A19) will use TSMC’s 2nm wafers.
N2 technology will bring some interesting intrinsic performance improvements to the chips. The company estimates a 10% to 15% performance improvement with a 25% to 30% reduction in power consumption, in addition to a 15% increase in transistor density. These figures are compared to the N3E process used on TSMC’s 3nm chips. The tech giant claims its new wafers offer “full node improvements.”
Lately, improved versions of the N2 process are also on track. By 2026, the company will begin implementing N2P technology, while 2027 will be the year of the N2X process. These chips will still be 2nm but will get some slight improvements.
