MediaTek’s chipset offerings have gotten more exciting over the years. This is because the company’s newer flagship chipsets have seen massive improvements, allowing them to compete with the likes of Qualcomm on a more even footing. Next year, MediaTek is expected to introduce its next-gen model, the Dimensity 9500, and thanks to a new leak, the details of the chipset have surfaced.
MediaTek Dimensity 9500 details
A Reddit post shared the details of the MediaTek Dimensity 9500. Previous reports suggested that the Dimensity 9500 could use TSMC’s N3P process. Now, this post reveals the exact configuration of the Dimensity 9500, providing more details than before.
According to the post, the Dimensity 9500 will feature 2x Cortex X930 cores clocked at around 4GHz and 6x Cortex A730 cores clocked at speeds around 3.5GHz. This means that the chipset will utilize a 2+4 configuration. For context, the Dimensity 9400 uses a 1+3+4 configuration, which consists of a single Cortex X925 performance core, 3x Cortex X4 cores, and 4x Cortex-A720 efficiency cores.
This should result in the Dimensity 9500 being a considerably more powerful chipset. Earlier reports have suggested that the Dimensity 9500 could hit benchmark scores of close to 4,000 for single-core performance. This represents an increase in performance of about 33% over the Dimensity 9400, which is already a pretty impressive chipset.
Snapping at Qualcomm’s heels
The public used to know MediaTek as a more budget-friendly alternative to Qualcomm. That has changed in recent years. MediaTek has proven that it has the chops to go head-to-head with Qualcomm, especially with its flagship Dimensity 9xxx chipsets.
The Dimensity 9500 could further narrow this gap and go toe-to-toe with the Snapdragon 8 Elite Gen 2, the successor to the Qualcomm Snapdragon 8 Elite introduced a few months ago.
An interesting piece of information is that MediaTek won’t be alone in will utilize TSMC’s N3P process for its next-gen flagship chipsets. Rumors suggest that Qualcomm is also planning the same. Recently, reports indicated that Samsung attempted to secure a deal to produce the Snapdragon 8 Elite 2 but failed.
TSMC’s N3P is still based on the 3nm process. The main difference is that it should offer improvements over the N3E process, such as performance gains. This could result in more powerful chipsets, although they may be costlier to produce.
Time will tell if the specs of the Dimensity 9500 can convince more handset makers to adopt MediaTek’s chipsets. Qualcomm’s chipsets are still very much the preferred choice in the industry. Hopefully, these improvements will give OEMs a worthwhile alternative.
