It seems that Samsung Foundry has finally managed to stabilize its 3nm GAA chip production process. The company was struggling with it for a long time, even preventing the implementation of the Exynos 2500 in the Galaxy S25 series. Now, Samsung plans to use the 3nm Exynos 2500 chip in some of its next-gen foldables, including the Galaxy Z Flip 7 and Galaxy Z Flip FE.
The Exynos 2500 chip will be inside the affordable Galaxy Z Flip FE too
A top Samsung executive revealed interesting details about the company’s Exynos chips and future foldables. First, the official revealed in a statement that the Exynos 2500 chip will power the Galaxy Z Flip 7. In addition, he confirmed that, contrary to previous leaks, the flagship Exynos SoC will be present in the Galaxy Z Flip FE.
The mention of the Z Flip FE by a Samsung official is important, as the firm is confirming its development. According to leaks, the Galaxy Z Flip FE will be the company’s most affordable foldable phone by 2025. Some sources claimed that, in order to cut costs, Samsung could turn to the 4nm Exynos 2400e chip. This hardware is present in the Galaxy S24 FE as well, delivering good results.
However, Samsung is actually planning to implement its most powerful Exynos processor in the Galaxy Z Flip FE as well. This is great news for those potentially interested in the device. After all, they won’t have to settle for less powerful hardware.
Samsung Foundry can now mass produce 3nm chips
The official also revealed that Samsung Semiconductors and Samsung Foundry have been working together to stabilize 3nm wafers. “As the business went through difficulties, there were times when the two business units were held accountable, but we agreed to work together to stabilize the situation,” he said (translated from Korean).
Samsung Foundry is now able to mass produce 3nm chips with economically viable yield rates. Industry insiders revealed that the previous yield rate of its factories ranged between 10% and 30%. The new head of Samsung’s semiconductor business also recently said that it is working on improving the company’s 2nm process. The firm wants to avoid the “3nm nightmare” in the production of next-gen chips.
